MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component, wherein cracking of a ceramic element body can be prevented from occurring. SOLUTION: The manufacturing method for the electronic component comprises: a step of calcinating a ceramic element body 7, having internal conductor patterns 2 to 5; a step of immersing the ceramic element body 7, in a solution containing compounds represented by general formula: X-Si-(OR)3(where, R is alkyl group with a carbon number of 1, and X is functional group that forms a chemical bond with organic materials, such as, vinyl group, amino group, mercapto group, epoxy group and methacrylate group); a step of drying the ceramic element body 7; a step of barrelling the ceramic element body 7 in another solution; a step of thermal treatment of the ceramic element body 7; and a step of forming external electrodes 8a to 8d in conduction with the conductor patterns 2 to 5 on both sides of the ceramic element body 7. COPYRIGHT: (C)2009,JPO&INPIT