| 摘要 |
PROBLEM TO BE SOLVED: To solve problems wherein terminals of a semiconductor element may be bent by a probe to come into contact with them and to be separated from the terminals in a conventional apparatus for inspecting characteristics of semiconductor elements through the use of the probe, it is difficult to maintain a completely separate state at the time of inspecting a plurality of terminals, and then degradations such as the peeling-off of terminals of the probe may occur. SOLUTION: A semiconductor element inspection apparatus has a holder opposed to terminals of a semiconductor for moving in parallel with them. A probe chip made of a gold alloy to be a contact is secured to an end of the holder. The probe has a spring property and comes into direct contact with the terminals by the probe chip. A loading plate is secured to the edge of a turntable at an appropriate pitch, and a through-hole part for fitting a semiconductor, a workpiece to be inspected, is formed in the loading plate. A spacer member for terminals of semiconductors are opposed to the through-hole from below. COPYRIGHT: (C)2009,JPO&INPIT
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