发明名称 INK FOR CONDUCTOR PATTERN FORMATION, CONDUCTOR PATTERN, AND WIRING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide an ink for conductor pattern formation excellent in discharge stability of droplets and capable of forming a conductor pattern with high reliability, to provide a conductor pattern of high reliability, and to provide a wiring substrate of high reliability equipped with the conductor pattern. <P>SOLUTION: The ink for conductor pattern formation, for forming a conductor pattern imparted to a ceramic molding body structured of materials including ceramic particles and a binder by a droplet discharge method, contains an aqueous dispersion medium, and metal particles dispersed in the aqueous dispersion medium, with a total content of oxygen and nitrogen in the ink for conductor pattern formation measured by the gas chromatography of 12 ppm or less. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009146624(A) 申请公布日期 2009.07.02
申请号 JP20070320244 申请日期 2007.12.11
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI;KOBAYASHI TOSHIYUKI;ENDO SACHIKO;UEHARA NOBORU;SUMIYA AKIHIKO
分类号 H01B1/22;B41M5/00;C07C33/044;C09D11/02;C09D11/023;C09D11/033;C09D11/326;C09D11/38;C09D11/52;H01B5/14;H01B13/00;H05K3/10 主分类号 H01B1/22
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