PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

摘要

Packaged integrated circuits having surface mount devices and methods to form the same are disclosed. A disclosed method comprises attaching an integrated circuit to a first side of a substrate, forming one or more first conductive elements on the substrate, attaching a surface mount device to a second side of the substrate via the first conductive elements, forming one or more second conductive elements on the second side of the substrate.