| 摘要 |
PROBLEM TO BE SOLVED: To prevent a flexible wiring board from being damaged when shrinking after being heated by suppressing thermal expansion of a driving substrate due to heating in an connecting operation of the driving substrate and flexible wiring board. SOLUTION: Disclosed is the driving substrate connected to a display panel through the flexible wiring board, wherein a plurality of connection land portions connected to the flexible wiring board are provided on a top surface of the substrate at intervals along the length of the substrate, and conductors are stacked in the substrate or/and on a substrate reverse surface. The conductor is disposed neither in the substrate nor on the substrate reverse surface right below a connection land portion to which the flexible wiring board is heat-crimped, and the conductor amount right below the connection land portion is made less than that right below a non-connection land portion provided between connection land portions and not connected to the flexible wiring board. COPYRIGHT: (C)2009,JPO&INPIT
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