PHOTOSENSITIVE RESIN COMPOSITION WHICH COMPRISE POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE COMPOSITION

摘要

Disclosed is a polyimide precursor characterized by having a polyimide structure represented by the general formula (1) below and a polyamide acid structure represented by the general formula (2) below. [chemical formula 1] [chemical formula 2] (In the formulae, R1 and R6 each represents a tetravalent organic group having 1-50 carbon atoms; R2 represents a divalent organic group having 1-30 carbon atoms; R5 represents a divalent organic group having 1-80 carbon atoms; R3 represents a monovalent organic group having 1-30 carbon atoms; and n represents an integer not less than 1 but not more than 30.)