| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesive characteristics between a dicing sheet and a ring frame, while keeping easiness in peeling between the dicing sheet and a die attachment film in pickup. SOLUTION: In the manufacture of an electronic component, the dicing sheet is laminated on the ring frame to fix a wafer for dicing. The dicing sheet has a base material sheet, an adhesive layer layered onto the base material sheet, and an adhesive layer for the ring frame layered in a scheduled region for laminating the ring frame in the adhesive layer. In this case, the adhesive force of the adhesive layer for the ring frame is larger than that of the adhesive layer. COPYRIGHT: (C)2009,JPO&INPIT
|
