发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce sizes of the crystalline grains, by improving the surface morphology of a polysilicon germanium film. SOLUTION: The method includes: a step of forming an amorphous silicon film on a substrate under a first pressure; and a step of forming the polysilicon germanium film over the amorphous silicon film under a second pressure, wherein for the second pressure, the pressure at the initial phase of the film formation is 100 Pa or more and 150 Pa or less, and the pressure at the terminal phase of the film formation is 30 Pa or more and 60 Pa or less. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147388(A) 申请公布日期 2009.07.02
申请号 JP20090080822 申请日期 2009.03.30
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YAMAZAKI HIROHISA;NODA TAKAAKI
分类号 H01L21/205;C23C16/42;H01L21/28;H01L21/285 主分类号 H01L21/205
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