发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SHIELDING |
摘要 |
An integrated circuit package system comprising: providing an elevated tiebar; forming a die paddle connected to the elevated tiebar; attaching an integrated circuit die over the die paddle adjacent the elevated tiebar; attaching a shield over the elevated tiebar and the integrated circuit die; and forming an encapsulant over a portion of the elevated tiebar, the die paddle, and the integrated circuit die.
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申请公布号 |
US2009166822(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20070965586 |
申请日期 |
2007.12.27 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN;BATHAN HENRY DESCALZO;GOVINDAIAH GURUPRASAD BADAKERE |
发明人 |
CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN;BATHAN HENRY DESCALZO;GOVINDAIAH GURUPRASAD BADAKERE |
分类号 |
H01L23/495;H01L21/02 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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