发明名称 |
SEMICONDUCTOR LIGHT-EMITTING DEVICE |
摘要 |
A semiconductor light emitting device is provided to increase the circuit board and the bond strength to increase the room degree. The semiconductor light emitting device comprises a semiconductor light emitting device, and a conductive layer(4, 5) and a plating layer. The semiconductor light emitting device(1) is a light source of the semiconductor light emitting device. The conductive layer is arranged in the insulating substrate(6). The conductive layers extend to the other side from one side of the insulating substrate. The plating layer is arranged in a part of conductive layers. The electroplated layer is comprised of the conductive element improving a solder diffusion property. |
申请公布号 |
KR20090072969(A) |
申请公布日期 |
2009.07.02 |
申请号 |
KR20080129294 |
申请日期 |
2008.12.18 |
申请人 |
STANLEY ELECTRIC CO., LTD. |
发明人 |
ODAWARA MASAKI;AOKI DAI |
分类号 |
H01L23/28;H01L23/48;H01L33/48 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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