| 发明名称 |
Controlled Impedance Structures for High Density Interconnections |
| 摘要 |
An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described. |
| 申请公布号 |
US2009167334(A1) |
申请公布日期 |
2009.07.02 |
| 申请号 |
US20090348273 |
申请日期 |
2009.01.02 |
| 申请人 |
INTERCONNECT PORTFOLIO LLC |
发明人 |
FJELSTAD JOSEPH C.;GRUNDY KEVIN P. |
| 分类号 |
G01R1/067;H01L23/528 |
主分类号 |
G01R1/067 |
| 代理机构 |
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