COPPER FOIL ATTACHED TO THE CARRIER FOIL, A METHOD FOR PREPARING THE SAME AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

Ultra-thin copper foil in which carrier foil is attached, a manufacturing method and a print circuit board using the same are provided to offer a peeling layer under processing environment of high temperature using high heat resistance resin. Ultra-thin copper foil in which carrier foil comprises carrier foil, a peeling layer, and the ultrathin copper foil. The peeling layer includes a first metal having strippability, a second metal and a third metal making plating of the first metal convenient. The peeling layer includes the first metal 30 - 89 weight%, the second metal 10 -60 weight%, and the third metal 1 -20 weight%. The first metal is Mo or W. The second metal and the third metal are different metal selected from a group consisting of Fe, Co, and Ni.