| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device preventing disconnection of wiring. SOLUTION: The device includes an interposer substrate mounted on a film substrate and a semiconductor element mounted on the interposer substrate. The interposer substrate includes a plurality of first substrate metal bumps, a plurality of first substrate pad metals 23 and a plurality of substrate wirings 24. The semiconductor element includes a plurality of element metal bumps bonded to the first substrate metal bumps by thermal clamping, a plurality of element pad metals 13 and a plurality of element wirings 14. The first substrate pad metals 23 and the element pad metals 13 have polygonal shapes where respective angles project outward. The substrate wirings 24 are connected to positions with spacing from vertexes of the angles of the corresponding first substrate pad metals 23. The element wirings 14 are connected to positions with spacing from the vertexes of the angles of the corresponding element pad metals 13. COPYRIGHT: (C)2009,JPO&INPIT
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