发明名称 |
Verfahren zur Einkapselung von einem photovoltaischen Modul mittels eines Einkapselungsmaterials |
摘要 |
In the present invention, a diaphragm (21) for pressurizing and heating encapsulating materials (4) and (7) is pre-heated to a predetermined temperature before laminating a lamination unit (1) comprising a photovoltaic module (2) and the encapsulating materials (4) and (7). As a result, one surface of the lamination unit (1) is heated by a heater (15) provided on a table (14) and the other surface is heated by the diaphragm (21), so it is possible to prevent appearance of a temperature difference between the surfaces. <IMAGE> |
申请公布号 |
DE60042226(D1) |
申请公布日期 |
2009.07.02 |
申请号 |
DE2000642226 |
申请日期 |
2000.03.16 |
申请人 |
KANEKA CORP. |
发明人 |
SUZUKI, TAKAYUKI;YAMAGISHI, HIDEO;KONDO, MASATAKA |
分类号 |
H01L31/048;H01L21/8234;H01L23/28;H01L31/0203;H01L31/042;H01L31/18 |
主分类号 |
H01L31/048 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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