ＣＭＰ研磨液以及使用该研磨液之基板研磨方法,申请号TW097140690-传众专利搜索

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发明名称	ＣＭＰ研磨液以及使用该研磨液之基板研磨方法
摘要	一种用以对具有含钌层之基板进行研磨的CMP研磨液以及使用该CMP研磨液的基板研磨方法，该CMP研磨液含有氧化剂、研磨粒子、水以及具有以下述式（1）所表示的结构的化合物或其盐，与使用先前的研磨液的情况相比可至少使钌层的研磨速度得到提高。[化1]#P 097140690P01.bmp
申请公布号	TW200927902	申请公布日期	2009.07.01
申请号	TW097140690	申请日期	2008.10.23
申请人	日立化成工业股份有限公司	发明人	南久贵;小野裕;天野仓仁
分类号	C09K3/14(2006.01);C07C279/02(2006.01);H01L21/304(2006.01)	主分类号	C09K3/14(2006.01)
代理机构		代理人	詹铭文;萧锡清
主权项
地址	日本

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