| 摘要 |
An epoxy resin composition for encapsulating a semiconductor device is provided to maintain excellent fluidity and heat conductivity, to improve adhesive property with various lead frames, and to secure high reliability. An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, hardener, curing accelerator, adhesion improver and inorganic filler. The adhesion improver uses a triazole-based compound represented by chemical formula I. The inorganic filler comprises spherical crystalline silica. The triazole-based compound is used in the amount of 0.01~2 weight% based on the whole epoxy resin composition. The epoxy resin comprises a phenol aralkyl type epoxy resin represented by chemical formula II or a biphenyl type epoxy resin represented by chemical formula III. |
