WAFER BUMPING TEMPLATE MANUFACTURED BY GLASS FORMING AND MANUFACTURING METHOD THEREOF

摘要

A wafer bumping template manufactured by glass forming and manufacturing method thereof are provided to improve fine cavities by manufacturing the cavities at the same time with a mold as glass forming. A template forms a solder pump and is transferred an electrode while including a plurality of cavities(11) formed on one side of a material for a flat board. The cavities are formed by pressing a mold having protrusions(21) by a certain pressure while the material for the flat board which is heated by a temperature within a certain range. The flat board material comprises one among glass, quartz, film, ceramics and metal. The mold is the metal material having a melting point higher than that of the flat board material.