发明名称 |
CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD |
摘要 |
<p>The present invention forms a conductive pattern using a simple process on a general plastic substrate having flexibility, and also provides a conductive pattern forming film that allows for easy formation of a conductive pattern using an apparatus that performs a simple process of oriented pressurization at low temperature, as well as a method for forming conductive pattern and a conductive pattern forming apparatus for the same. The conductive pattern forming film provides a pattern formed on a film substrate having flexibility by pressurizing, under heating, a conductive paste in which powder or fine particles of metal or semiconductor are dispersed and filled. The conductive pattern forming apparatus comprises a sample installation table having a flat placement surface, and a driving body for pressure application which is placed in a manner facing the placement surface and movable, wherein the driving body for pressure application is equipped with a support which is constituted by a flat metal panel having metal spheres along its bottom face.</p> |
申请公布号 |
EP2075802(A1) |
申请公布日期 |
2009.07.01 |
申请号 |
EP20070829964 |
申请日期 |
2007.10.17 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY |
发明人 |
KAMATA, TOSHIHIDE;YOSHIDA, MANABU |
分类号 |
H05K1/03;H05K3/10;H05K3/12 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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