| 摘要 |
An apparatus for fabricating semiconductor devices is provided to decrease the apparatus abrasion by separately managing the isolation part and engaging part of equipment. The power is generated from the power transmission. The power is delivered to the valve head part through a torque prevention unit. A joint hole(601) is the hole for connecting a power bar(606). A limit line(602) shows the final position of the power bar. A slide line(603) is the load which it is to go to the limit line. A tightening wrench(605) is separated from a lock bar(604) to outside. A lock loader(607) is the path through which the lock bar moves. An open key(609) is the key for separating.
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