| 摘要 |
<p>A flexible film is provided to improve dimensional stability of a circuit pattern by forming an insulation film by material which has moisture absorptivity of 0.01~3.5%. A flexible film(100a) includes an insulation film(110a) and a metal layer. The insulation film has moisture absorptivity of 0.01~3.5%. The insulation film includes at least one among polyimide, polyester, and liquid crystal polymer. The metal layer is arranged on the insulation film. The metal layer includes at least one among nickel, chrome, gold, and copper. The metal layer includes a first metal layer(120a) and a second metal layer(130a). The first metal layer is formed on the insulation film by electroless plating. The second metal layer is formed on the first metal layer by electroplating. A thickness ratio between the metal layer and the insulation film is 1:1.5~1:10.</p> |
