| 摘要 |
An apparatus and a method for cooling a substrate are provided to improve efficiency of a cooling process by installing an injection line injecting the cooling fluid in a side of a support plate. A chamber(110) provides a receiving space for receiving a plurality of substrates. A plurality of support plates(120) are equipped in the receiving space. The respective substrate is received. An injection line(130) is installed in a side of the support plate and injects the cooling fluid for cooling the substrate. The injection line has a plurality of injection holes injecting the cooling fluid. The injection holes face the substrate positioned under the injection line.
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