| 摘要 |
A camera module and a manufacturing method thereof are provided to simplify a manufacturing process, to minimize the assembling tolerance between components and to save the manufacturing cost. A wafer level package(150) comprises a wafer(151), a micro-lens(153) and an external connecting terminal(152). The micro-lens is formed on an upper face, and the external connection terminal is formed on a lower face. A lens holder(120) holds a wafer lens of which rids are projected to the lower face. The wafer level package and the lens holder are assembled through an adhesive.
|
