FLIP CHIP TECHNOLOGY WITHOUT SOLDER RESIST AND UNDER-FILL INK PROCESSES

摘要

A flip chip mounting scheme is provided to remove a separate under fill ink injecting process by using a thermoplastic member instead of a photosensitive solder resist. A package substrate performs an electrical flip chip junction by bonding a stud bump(10) and a solder bump(120) formed on a pad of a semiconductor die. A thermoplastic resin(130) is formed in one surface of the package substrate where a copper circuit and a pad are formed. A cavity is formed on a pad(40) to expose the pad by opening the thermoplastic resin layer. A solder bump is formed on the pad indie the cavity. The stud bump and the solder bump are fused and bonded. The interval between a substrate pad and a semiconductor die is sealed by fusing and heating the thermoplastic resin layer.