STRUCTURE INTENDED FOR THE THERMAL MANAGEMENT OF INTEGRATED CIRCUITS AND MICROSYSTEMS

摘要

The invention relates to a structure intended for the thermal management of integrated circuits and microsystems allowing the selective cooling of certain circuit portions. The selectivity is given by the possibility of configuring the structure (1) for the thermal management of integrated circuits and microsystems so that the hot zone (7) does not dissipate heat to other portions of the substrate (3) but the cooling pads (8), The claimed structure (1) can be used as such or combined with other cooling methods, such as the thermoelectric method or using microfluidics elements.