发明名称 Low temperature curable conductive adhesive and capacitors formed thereby
摘要 An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has: 60-95 wt % conductor; 5-40 wt % resin; wherein the resin has: 55-98.9 wt % monomer defined by the formula: wherein: R is an aliphatic group of 1 to 10 carbons; R1 is an aliphatic group of 1 to 10 carbons; R2 is an alkyl, alkyl ether, aryl ether, silane or silicone; and wherein R and R1, R and R2 or R1 and R2 may be taken together to form a cyclic alkyl or aryl group; 0.1-15 wt % catalyst; 1-30 wt % accelerant defined by the formula: wherein R3 is an alkyl or substituted alkyl of 1-10 carbons; and R4 is an alkyl or substituted alkyl of 1-10 carbons with the proviso that at least one of R3 and R4 is substituted with a OR5 wherein R5 is selected from hydrogen, alkyl and aryl; and 0-15 wt % filler.
申请公布号 US7554793(B2) 申请公布日期 2009.06.30
申请号 US20060600657 申请日期 2006.11.16
申请人 KEMET ELECTRONICS CORPORATION 发明人 CHACKO ANTONY P.
分类号 H01G9/02 主分类号 H01G9/02
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