发明名称 Liquid metal thermal interface material system
摘要 A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
申请公布号 US7554190(B2) 申请公布日期 2009.06.30
申请号 US20050248720 申请日期 2005.10.11
申请人 MACRIS CHRIS;SANDERSON THOMAS R;EBEL ROBERT G 发明人 MACRIS CHRIS;SANDERSON THOMAS R.;EBEL ROBERT G.
分类号 H01L23/10;H01L23/34 主分类号 H01L23/10
代理机构 代理人
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