| 摘要 |
<p>A wire bonding process for insulated wires is provided to bond easily wires having insulated or non-conductive materials by improving a wire bonding method. An arranging process is performed to arrange a tip of an insulated wire(10) is arranged near to an electron flame-off device. A finishing process is performed to generate a first electrical discharge from the electron flame-off device in order to generate a pilot ball by melting the tip of the insulated wire, and to finish the electrical discharge. A second electrical discharge process is performed to generate a confirming free air ball(34). An attaching process is performed to attach the confirming free air ball on a bonding surface in order to generate a ball bond. The pilot ball has a small size of volume in comparison with the confirming free air ball.</p> |
