PHOTOSENSITIVE RESIN COMPOSITION

摘要

Disclosed is a photosensitive resin composition containing 100 parts by mass of a polyorganosiloxane (a), 1-50 parts by mass of a photopolymerization initiator (b), 40-600 parts by mass of a fluorene compound (c) represented by General formula (3), and 20-300 parts by mass of a compound (d) having one or two (meth)acryloyl groups in a molecule, which is not the component (c). The polyorganosiloxane (a) is obtained by mixing and polymerizing at least one silanol compound represented by General formula (1), at least one alkoxysilane compound represented by General formula (2) and a catalyst without actively adding water. R1 2Si(OH)2 (1) [In the formula, groups are as defined in claims.] R2 aR3 bSi(OR4)4-a-b (2) [In the formula, groups are as defined in claims.] (3) [In the formula, groups are as defined in claims.]