| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a peeling device for processing a laminate including a substrate and a support plate and peeling the support plate from the substrate, thereby efficiently performing peeling processing. <P>SOLUTION: The peeling device peels the support plate 14 from the substrate 12 of the laminate 10 in which the substrate 12 is bonded to the support plate 14. The peeling device includes: a first storing section 20 for storing the laminate 10; a plurality of first processing sections 30 for reducing adhesive force of an adhesive 13 applied between the substrate 12 and the support plate 14; and a first carrying section 50 which is capable of moving in the first direction and carries the laminate 10 from the first storing section 20 to the first processing section 30 while holding the laminate 10. With the first carrying section 50, it is possible to provide the peeling device 100 which moves straightly. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
