| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an opto-electric hybrid package and an opto-electric hybrid module capable of reliably reducing loss and degradation of optical signals. <P>SOLUTION: The opto-electric hybrid package 2 includes a solder ball 49, an optical device 24, a protruding section 53, and an optical waveguide structure 71. The solder ball 49 is bonded on a solder ball bonding section 48 and also connected to a substrate 61 with an optical waveguide. The optical device 24 is mounted on an optical device mounting section 56, with a light emitting section 25 of the device opposing to an optical waveguide 81. The protruding section 53 protrudes from the back face 13 of a wiring board 10 toward the substrate 61 with the optical waveguide. The optical waveguide structure 71 includes a core and a clad and penetrates the principal face 12 of the wiring board 10 and the top end face 54 of the protruding section 53. A level difference A1 from the surface of the solder ball bonding section 48 to the top end face 54 of the protruding section 53 is a half or larger than the maximum diameter A2 of the solder ball 49. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
