| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductor pattern forming ink for forming a conductor pattern with a high reliability and a wiring board. <P>SOLUTION: The conductor pattern forming ink is used for formation of a conductor pattern by being applied on a ceramic molded body containing ceramic particles and a binder by a liquid drop injection method, and contains an aqueous dispersant, metal particles, and a surface tension conditioner. When a contact angle of a liquid drop at 25°C to the ceramic molded body is madeδ(A)[°] and the contact angle of a liquid drop of a dispersion liquid in which the surface tension conditioner is not contained and which includes the same composition as the conductor pattern forming ink other than that the content of the aqueous dispersant is different, to the ceramic molded body is madeδ(B)[°], the relations of 15≤δ(B)-δ(A)≤60 are satisfied. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
