发明名称 Mold Forming and Molding Method
摘要 A mold forming and molding technology operable to produce a silicon ingot suitable for obtaining a solar cell substrate is disclosed. A slurry is prepared comprising particles with surface oxide layers operable to bond the particles to each other. An external force is applied to the slurry to eliminate cohesion of the particles to form a de-cohesive slurry, and an inner surface of a mold base is coated with the de-cohesive slurry to form a releasing layer that reduces defects in the silicon ingot.
申请公布号 US2009159230(A1) 申请公布日期 2009.06.25
申请号 US20090392857 申请日期 2009.02.25
申请人 KYOCERA CORPORATION 发明人 TSUCHIDA MASAHIRO;GOTO SHIGERU;OKUSHIMA KENTARO;YAMATANI MUNEYOSHI
分类号 B28B7/38 主分类号 B28B7/38
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