| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can prevent an ESD protective element from being destructed by pressure at the time of bonding while having a pad structure which can secure bonding reliability, and is reduced in size as much as possible. <P>SOLUTION: A bonding area as an area for wire bonding and a probing area as an area to which a probe needle is applied in probing are prepared for an external electrode pad, and an ESD protective element and its electric discharge route are arranged below the probing area. Below the bonding area, a support via slightly smaller than the bonding area and a support pattern having a size equivalent to the bonding pad which is linked to the bonding pad through the support via are arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
