| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor processing device capable of simplifying a device constitution, saving its space, simplifying a control mechanism, and accelerating the speed of the processing of the device. SOLUTION: The semiconductor processing device 1 comprises: a ring transferring device 2 for transferring a ring R for retaining a wafer sheet W with a plurality of diced leadless device S adhered to a predetermined direction; a separating mechanism 3 for individually separating the device S from the wafer sheet W transferred to the predetermined take-up position by the ring transferring device 2; a pickup mechanism 4 for taking up the device S separated by the separating mechanism 3 to transfer it by being rotated at 90°; and a test handler 5 for taking up the device S from the pickup mechanism 4 by the retaining mechanism provided at an equal cyclotomic position and rotating it for various processing to the device. COPYRIGHT: (C)2009,JPO&INPIT |
