| 摘要 |
A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.
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