发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
摘要 A laminated ceramic electronic component and a manufacturing method thereof are provided to reduce a size of the electronic component by forming a Cu plating layer with the plating instead of a conductive plate. A ceramic body(2) is comprised by stacking a plurality of ceramic layers. An internal conductor is formed inside the ceramic body and has an exposure part in an outer surface. An external terminal electrode(9) is formed in an outer surface of the ceramic body and coats the exposure layer of the inner conductor. The external terminal electrode includes a Cu coating layer(20) coating the exposure part of the internal conductor. A Cu oxide material with a discontinuous shape is in the interface with the ceramic body and the Cu plating layer.
申请公布号 KR20090068147(A) 申请公布日期 2009.06.25
申请号 KR20080129364 申请日期 2008.12.18
申请人 MURATA MANUFACTURING CO., LTD. 发明人 TAKEUCHI SHUNSUKE;KAWASAKI KENICHI;MOTOKI AKIHIRO;OGAWA MAKOTO;MATSUMOTO SHUJI;NISHIHARA SEIICHI
分类号 H01G4/232;H01G4/30 主分类号 H01G4/232
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