| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing cracking from occurring in a package during a solder reflow process by using a suitable heat-resistant adhesive, not required to use a base material tape. <P>SOLUTION: A method for manufacturing a semiconductor, comprises the steps of: forming an inorganic insulating film 9 on a semiconductor chip 6; forming an adhesive film layer 1 on the inorganic insulating film 9; removing predetermined portions from the adhesive film layer 1 with an organic solvent to form a desired pattern of the adhesive film layer 1 on the active element face of the semiconductor chip 6 as to open each electrode element 8 on the active element; adhering a lead frame 3 to the semiconductor chip 6 through the adhesive film layer 1 having a desired pattern on the surface of the semiconductor chip 6; and electrically connecting the electrode 8 on an active element of the semiconductor chip 6 to a lead frame 1 with a wire 4. <P>COPYRIGHT: (C)2009,JPO&INPIT |
