| 摘要 |
PROBLEM TO BE SOLVED: To use a single-layer single-sided board in common for apparatus even when they have respectively signal amplifying ICs having their outputs different from each other, in an attaching structure for attaching the signal amplifying IC, whose calorific value increases as its output increases, to the single-layer single-sided board. SOLUTION: In the attaching structure for attaching a substantially rectangular signal amplifying IC, in each side of one set of whose opposed sides a plurality of leads are arranged in parallel with each other and whose calorific value increases as its output increases, the single-layer single-sided board 52 has openings 52a and a lid portion 52b. Further, when using the single-layer single-sided board 52 for an apparatus having the signal amplifying IC 51 having its output not larger than a predetermined value, a copper foil formed on the surface of the lid portion 52b is so connected with a thermal pad 51c as to radiate the heat of the IC 51 from the copper foil. Moreover, when using the single-layer single-sided board 52 for another apparatus having the signal amplifying IC 51 having its output larger than the predetermined value, the lid portion 52b is so divided into sub-lid portions as to remove them from the board 52, and then, a heat sink 53 is so fastened to the width-directional ends of the openings 52a from the component-plate side of the board 52 as to radiate the heat of the IC 51 from the heat sink 53 by connecting the heat sink 53 with the thermal pad 51c. COPYRIGHT: (C)2009,JPO&INPIT
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