| 摘要 |
An image sensor includes circuitry, a metal interconnection, a first substrate, a metal ion-implanted insulating layer, and a photodiode. The circuitry is formed on and/or over the first substrate, and the metal ion-implanted insulating layer is formed on and/or over the metal interconnection. The photodiode is formed in a crystalline semiconductor layer over the metal ion-implanted insulating layer.
|
