| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding material enabling the prevention of delamination and voids caused in a bonding area after firing. <P>SOLUTION: A bonding material 1 is used for bonding an unfired ceramic body A, having internally formed a cavity portion or formed a concaved portion in a part of a surface on a side of a bonding surface, and another unfired ceramic body B. The bonding material 1 is applied to a bonding area between the unfired ceramic bodies A and B in a thickness ranging from 10-25 μm, in which the unfired ceramic bodies A and B have firing contraction ratios with the difference lying in a value within 1%, to allow the unfired ceramic bodies A and B to be bonded with each other in the bonding area to provide a bonded body, which in turn is fired to obtain a ceramic bonded body 3. The bonding material 1 includes an inorganic powder, an organic binder and an organic solvent, and the formulae expressed by 0≤X-Z≤2.6 and 0≤Y-Z≤2.6 are satisfied, where X represents the firing contraction ratio of the unfired ceramic body A, Y represents the firing contraction ratio of the unfired ceramic body B and Z represents the firing contraction ratio of the bonding material. <P>COPYRIGHT: (C)2009,JPO&INPIT |
