发明名称 CONDUCTOR PATTERN FORMING INK, CONDUCTOR PATTERN, AND WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductor pattern forming ink which is superior in preservation performance and prevents occurrence of cracks in a conductor pattern formed. <P>SOLUTION: The conductor pattern forming ink is an ink for forming a conductor pattern on a board by a liquid drop injection method, and contains metal particles, an aqueous dispersant in which the metal particles are dispersed, sugar alcohol of disaccharide origin, and a polyglycerol compound having polyglycerol skeleton, and H expressed in the formula (I) is 0.10-0.80. Here, in the formula, OH(A)[pieces], Mw(A), X(A)[wt.%] expresses respectively an average number of pieces of hydroxy group in a molecule of polyglycerol compound, weight average molecular weight, its content in the conductor pattern forming ink, and OH(B)[pieces], Mw(B), X(B)[wt.%] expresses respectively the number of pieces of hydroxy group in a molecule of sugar alcohol of disaccharide origin, its molecular weight, its content. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009140881(A) 申请公布日期 2009.06.25
申请号 JP20070319017 申请日期 2007.12.10
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI
分类号 H01B1/22;B05D1/26;B82Y30/00;C09D11/00;C09D11/52;H01B5/14;H05K1/09;H05K3/10 主分类号 H01B1/22
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