| 摘要 |
PROBLEM TO BE SOLVED: To prevent burr from being generated in a cutting surface in a manufacturing method of a semiconductor device having a process for dicing a semiconductor wafer where a die-bonding film is provided on a circuit surface. SOLUTION: The manufacturing method of a semiconductor device has: a process for providing the die-bonding film 1 made of a photosensitive adhesive on the circuit surface of the semiconductor wafer 2; a process for patterning the die-bonding film 1 so that an opening 11 for exposing a dicing line 90 in the semiconductor wafer 2 is formed by exposure and development; and a process for cutting and dividing the semiconductor wafer 2 into a plurality of semiconductor chips 20 by cutting the semiconductor wafer 2 along the exposed dicing line 90 by a dicing blade 70. COPYRIGHT: (C)2009,JPO&INPIT
|
