发明名称 |
INTEGRATED CIRCUIT SYSTEM WITH CONTACT INTEGRATION |
摘要 |
A method for forming an integrated circuit system includes providing an integrated circuit device; and forming an integrated contact over the integrated circuit device including: providing a via over the integrated circuit device; forming a selective metal in the via; forming at least one nanotube over the selective metal; and forming a cap over the nanotubes.
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申请公布号 |
US2009159985(A1) |
申请公布日期 |
2009.06.25 |
申请号 |
US20070963254 |
申请日期 |
2007.12.21 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BESSER PAUL R. |
分类号 |
H01L29/94;H01L21/44 |
主分类号 |
H01L29/94 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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