发明名称 INTEGRATED CIRCUIT SYSTEM WITH CONTACT INTEGRATION
摘要 A method for forming an integrated circuit system includes providing an integrated circuit device; and forming an integrated contact over the integrated circuit device including: providing a via over the integrated circuit device; forming a selective metal in the via; forming at least one nanotube over the selective metal; and forming a cap over the nanotubes.
申请公布号 US2009159985(A1) 申请公布日期 2009.06.25
申请号 US20070963254 申请日期 2007.12.21
申请人 ADVANCED MICRO DEVICES, INC. 发明人 BESSER PAUL R.
分类号 H01L29/94;H01L21/44 主分类号 H01L29/94
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