| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connection structure capable of preventing contamination in the case of microfabrication and high densification of circuit patterns and achieving a highly reliable connection between substrates. <P>SOLUTION: The connection structure is used to electrically connect a terminal section of a hard substrate and a terminal section of a soft substrate. The connection structure includes a first substrate CB1 formed by a soft base material (first base material 102) where a wiring pattern 101 is formed, and a second substrate CB2 formed by a hard base material (second base material 105) where a wiring pattern 104 is formed. The wiring pattern 101 on the first base material 102 and the wiring pattern 104 on the second base material 105 are thermally force-stuck so as to make electrical and mechanical connection while both wiring patterns are opposite each other via an adhesive 107, and a second zone R2 as an extension section of the first base material 102 is located to overlap with the wiring pattern 104 (third and fourth circuit patterns 104A, 104B, ...) in a third zone R3 of the second base material 105, and the wiring pattern 104 is coated by the adhesive 7 by firmly sticking the wiring pattern 104. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
