| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of dividing a wafer by which a wafer provided therein an altered layer along streets can be divided along the streets without breaking it in a feeding step or the like. SOLUTION: The method of dividing the wafer includes: a step of adhering a protective tape to a face-side surface of the wafer; a step of forming the altered layer along the streets by laser; a first feeding step in which the whole area of the wafer's back-side surface is suction held, and the wafer is mounted on a dicing tape adhering unit; a step of adhering a dicing tape to the wafer's back-side surface and an annular frame; a step of holding the whole area of the wafer's back-side surface by suction through the dicing tape and also holding the annular frame by suction to reverse the wafer; a second feeding step of feeding the wafer and the annular frame to a tape expanding unit while holding the whole area of the wafer's face-side surface by suction through the protective tape and also holding the annular frame by suction; a step of peeling off the protective tape adhered to the wafer's face-side surface; and a step of expanding the dicing tape so as to divide the wafer along the streets along which the altered layer has been formed. COPYRIGHT: (C)2009,JPO&INPIT |
