| 摘要 |
A wafer inspection apparatus and a wafer inspection method are provided to inspect a defect of patterns formed on a surface of a wafer by irradiating light on the surface of the wafer and detecting the wavelength of the light scattered from the wafer. A wafer inspection apparatus(100) includes a stage(110), a light source unit(120), at least one sensor unit(130), and a signal processing unit(140). A wafer(W) is positioned on an upper part of the stage. The light source unit is positioned apart from the upper part of the stage. The light source unit irradiates incident light on an upper surface of the wafer. The sensor unit is positioned apart from the upper part of the stage. The sensor unit detects the wavelength of the light scattered from the wafer. The signal processing unit is connected to the sensor unit. The signal processing unit determines the defective state of the pattern on the wafer by analyzing the wavelength of the scattered light.
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