| 摘要 |
<p>A stacked package is provided to perform easily an exchange process in an abnormal state by forming a structure to be connected with a conductive material on a semiconductor chip. A stacked package includes a semiconductor chip(100), a TSOP type package(110), and a conductive material(104). A semiconductor chip includes a plurality of penetration holes(T). The penetration hole includes one end of a redistribution line for electrical connection. The TSOP type package is arranged on the semiconductor chip. The TSOP type package includes an outer lead(126). The outer lead is inserted into the penetration hole of the semiconductor chip. The outer lead is protruded to a lower part of the semiconductor chip. A conductive material is buried into the penetration hole of the semiconductor chip. The outer lead of the TSOP type package is connected with the redistribution line of the semiconductor chip.</p> |
