发明名称 PRESSING UNIT AND DIE BONDING HEAD HAVING A PRESSING UNIT
摘要 A pressing unit and a die bonding head having the same are provided to control accurately a load applied to a die adsorption unit by aligning a pin and a central shaft of a body for guiding a vertical movement of the pin with each other. A pressing unit(120) includes a housing(121) having a cavity, a pin(122), and a coil spring(124). The housing is moved in a vertical direction. A lower part of the housing is opened. The pin penetrates the housing. The pin is moved vertically along the cavity of the housing. The pin comes in contact with an object. The coil spring is installed in the cavity of the housing in order to surround the pin. The coil spring is pressed according to a falling state of the housing in order to apply a load to the object. The load for pressing the object is applied to the pin.
申请公布号 KR20090066458(A) 申请公布日期 2009.06.24
申请号 KR20070133989 申请日期 2007.12.20
申请人 SECRON CO., LTD. 发明人 WI, JAE WOO;KIM, DONG JIN
分类号 H01L21/58;H01L21/52;H01L21/60 主分类号 H01L21/58
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