BONDING FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY, BONDING FILM THEREFROM, AND DICING DIE BOND FILM COMPRISING THE SAME

摘要

An adhesive film composition for the assembly of a semiconductor is provided to increase the releasing of an adhesive film for preventing the fixation between films and to lower peel strength. An adhesive film composition for the assembly of a semiconductor comprises the modified silicone oil represented by the formula 1, an elastomeric resin containing a hydroxyl group or a carboxy group, a thermoplastic resin, an epoxy-based resin, a phenol curing agent, a curing catalyst, a silane coupling agent and a filler.