| 发明名称 |
System and method for hermetically sealing a package |
| 摘要 |
A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.
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| 申请公布号 |
US7550859(B2) |
申请公布日期 |
2009.06.23 |
| 申请号 |
US20070842806 |
申请日期 |
2007.08.21 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MICHAEL DON;ROSSMAN MARI J. |
| 分类号 |
H01L23/29;G02B6/36;H01L21/44;H01L21/48;H01L21/50;H01L21/54 |
主分类号 |
H01L23/29 |
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代理人 |
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